QCOM

$INTC x $QCOM IS HAPPENING? - Qualcomm's job listing for a Senior Staff Packaging Engineer seeks experience with EMIB, Intel's proprietary 2.5D interconnect technology for high-bandwidth multi-die integration, as a preferred skill, hinting at potential integration into their high-performance computing chips. - This mention aligns with reports of Qualcomm as Intel Foundry's first major customer for the 20A (2nm) process, signaling a strategic diversification from $TSM to leverage Intel's advanced packaging for improved yield and cost in complex SoCs. - Intel's recent expansions, like the $AMKR partnership for EMIB capacity, position it as a viable alternative in the packaging ecosystem, where EMIB enables denser interconnects than traditional methods, potentially boosting Qualcomm's AI and edge computing performance. Thank you @christophauto for this catch!